* Please refer to the exemption criteria given below the table:

Sl. No.

Category/Product

Point. No.

Exemption Criteria for particular Substances 

(B-5) *

Fluorescent and other Mercury containing lamps

1

Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):

(a)

for general lighting purposes <30 W: 2.5 mg

(b)

for general lighting purposes ≥ 30 W and <50 W: 3.5mg

(c)

for general lighting purposes ≥ 50 W and <150 W: 5mg

(d)

for general lighting purposes ≥150 W: 15 mg

(e)

for general lighting purposes with circular or square structural shape and tube diameter ≤17 mm: 7mg

(f)

for special purposes:5 mg

(B-5) *

Fluorescent and other Mercury containing lamps

2.(a)

Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp):

-1

Tri-band phosphor with normal life time and a tube diameter < 9mm (e.g.T2): 4mg

-2

Tri-band phosphor with normal life time and a tube diameter ≥ 9 mm and

≤ 17 mm (e.g., T5): 3 mg

-3

Tri- band phosphor with normal life time and a tube diameter >17 mm and

≤ 28 mm (e.g., T8): 3.5 mg

-4

Tri-band phosphor with normal life time and a tube diameter >28 mm (e.g., T12):3.5 mg

-5

Tri-band phosphor with long life time (≥25000 h):5mg

(B-15) *

Luminaries for fluorescent lamps with the exception of luminaries in households

2.(b)

Mercury in other fluorescent lamps not exceeding (per lamp):

-1

Linear halo phosphate lamps with tube >28 mm (e.g., T 10 and T12):10 mg

-2

Non-linear halo phosphate lamps (all diameters):15mg

-3

Non-linear tri-band phosphor lamps with tube diameter >17 mm (e.g.T9):15 mg

-4

Lamps for other general lighting and special purposes (e.g., induction lamps):15mg

3

Mercury in cold cathode fluorescent lamps and external electrode fluorescent lamps (CCFL and EEFL) for special purposes not exceeding (per lamp):

(a)

Short length (< 500 mm):3.5mg

(b)

Medium length (>500 mm and<1500 mm): 5mg

(c)

Long length (>1500 mm): 13mg

(B-17) *

Low pressure sodium lamps

4.(a)

Mercury in other low pressure discharge lamps (per lamp): 15mg

(b)

Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra>60:

(b)-I

P ≤155 W: 30 mg

(b)-II

155 W < P <405 W: 40 mg

(b)-III

P >405 W: 40 mg

(c)

Mercury in other High-Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner):

(c)-I

P<155 W:25mg

(c)-II

155 W < P < 405 W:30 mg

(c)-III

P >405 W:40 mg

(d)

Mercury in High Pressure Mercury (vapour) lamps (HPMV)

(e)

Mercury in metal halide lamps (MH)

(f)

Mercury in other discharge lamps for special purposes not specifically mentioned in this Schedule

(B-16) *

High intensity discharge lamps, including pressure sodium lamps and metal halide lamps

5.(a)

Lead in glass of cathode ray tubes

(b)

Lead in glass of fluorescent tubes not exceeding 0.2% by weight

(B-16) *

High intensity discharge lamps, including pressure sodium lamps and metal halide lamps

6.(a)

Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight

(b)

Lead as an alloying element in aluminium containing up to 0.4% lead by weight

(c)

Copper alloy containing up to 4% lead by weight

(B-16) *

High intensity discharge lamps, including pressure sodium lamps and metal halide lamps

7.(a)

Lead in high melting temperature type solders (i.e., lead-based alloys containing 85% by weight or more lead)

(b)

Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications

(c)

Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g., piezo electronic devices, or in a glass or ceramic matrix compound.

(d)

Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or250 V DC or higher

(e)

Lead in dielectric ceramic in capacitors for a rated voltage of less than 125V AC or 250 V DC

(B-18) *

Other lighting or equipment for the purpose of spreading or controlling light excluding filament bulbs

8.(a)

Cadmium and its compounds in one shot pellet type thermal cut-offs

(b)

Cadmium and its compounds in electrical contracts

(B-18) *

 Other lighting or equipment for the purpose of spreading or controlling light excluding filament bulbs

9

Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0.75% by weight in the cooling solution

(a)

Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) application.

10.(a)

Lead used in C-press compliant pin connector systems

(b)

Lead used in other than C-press compliant pin connector systems

11

Lead as a coating material for the thermal conduction module C- ring

12.(a)

Lead in white glasses used for optical applications

(b)

Cadmium and lead in filter glasses and glasses used for reflectance standards.

13

Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight

14

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages.

15

Lead in linear incandescent lamps with silicate coated tubes

16

Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications.

(B-16) * &(B-18) *

High intensity discharge lamps, including pressure sodium lamps and metal halide lamps.                      &    Other lighting or equipment for the purpose of spreading or controlling light excluding filament bulbs

17.(a)

Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as specialty lamps for diazo printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr, Ba)₂Mg Si₂O₇: Pb)

(b)

Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (Ba Si₂O₅: Pb)

18

Lead with PbBiSn-Hg and PblnSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL)

19

Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs)

20

Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses

21

Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm and less

22

Lead in solders for the soldering to machine through hole discoidal and planar array ceramic multilayer capacitors

23

Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring.

24

Lead oxide in the glass envelope of black light blue lamps

25

Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers

26

Lead bound in crystal glass

27

Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB(A) and more

28

Lead in soldering materials in mercury free flat fluorescent lamps (which e.g., are used for liquid crystal displays, design or industrial lighting)

29

Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes

30

Lead in solders for the soldering of thin copper wires of 100 µm diameter and less in power transformers

31

Lead in cermet’s-based trimmer potentiometer elements

32

Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display

33

Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body

34

Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide

35

Cadmium in colour converting II-VI LEDs (<10 µg Cd per mm of light- emitting area) for use in solid state illumination or display systems.